ASML is one of the world’s leading manufacturers of chip-making equipment.
Our vision is to enable affordable microelectronics that improve the quality of life.
To achieve this, our mission is to invent, develop, manufacture and service advanced technology for high-tech lithography, metrology and software solutions for the semiconductor industry.
ASML's guiding principle is continuing Moore's Law towards ever smaller, cheaper, more powerful and energy-efficient semiconductors. This results in increasingly powerful and capable electronics that enable the world to progress within a multitude of fields, including healthcare, technology, communications, energy, mobility, and entertainment.
ASML US, LP brings together the most creative minds in science and technology to develop lithography machines that are key to producing faster, cheaper, more energy-efficient microchips. We design, develop, integrate, market and service these advanced machines, which enable our customers - the world’s leading chipmakers – to reduce the size and increase the functionality of their microchips, which in turn leads to smaller, more powerful consumer electronics. Our headquarters are in Veldhoven, the Netherlands, and we have 18 office locations around the United States including main offices in Wilton, CT, Chandler, AZ and San Jose, CA.
Mechancial development (MDev) engineer works closely with MTD, electrical development (EDev) engineering, and supply chain engineering to create manufacturable design that meets all performance requirements. MTD provides electromagnetics specs…coil sizes, locations, number of wire turns, magnet sizes, magnet materials. EDEV provides insulation requirements, cabling and connector design support. MDEV packages coils and magnets to meet MTD, EDEV specs along with other specs such as thermal, dynamics, volume, stress, cleanliness, etc.
Minimum: BSME with machine design focus
Please apply with your CV and cover letter by the 'apply' button below
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2 - 5 years
|Job Location:||Wilton - CT, United States|
|Keywords:||TPD, BoMs, FEA, Thermal, Stress, Tolerance, Fluid Flow, Vibration, Analyses|
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