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We make life easier, safer and greener
The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.
Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives.
They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.
PhD topic at KAI: Material behaviour of semiconductor devices during real time operation – Method Development and Verification
Innovative semiconductor solutions for energy efficiency, mobility and security
Do you want to rise to the challenges of modern society and shape the technology of tomorrow? Then start with Infineon today! With 26,000 employees around the world, we're improving energy efficiency, enabling new mobility concepts and ensuring security in a digital world - by using innovative semiconductor and system solutions to steer the world towards a better, sustainable future.
For that we need:
Great passion. Amazing ideas. First-class skills. You.
Infineon Technologies Austria in Villach aims to improve its products, in terms of thermo-mechanical robustness by optimization of design and materials. In cooperation with the KAI competence centre in Villach a group of international researchers work on the characterization of materials and the development of material models. It is planned to extend the competencies towards material behavior by a PhD project in cooperation with the Erich Schmidt Institute / Montan University Leoben.
The metallization stack of a modern power device is basically a compound of brittle dielectric layers (oxide or nitride based glasses) and ductile metals (aluminum, copper), with connecting wires bonded on top of the stack, surrounded by a visco-elastic mold-compound (silica-enforced epoxy). Due to the mismatch in thermal expansion of different materials, the semiconductor is exposed to excessive mechanical stresses and hence deformation, degradation and destructive forces. The evolution of the thermal field due to a switching operation and its consecutive rise of mechanical stresses in thin films necessitates investigations on test structures on device level.
The offered PhD topic incorporates:
Please apply with your CV and cover letter by the 'apply' button below.
0 - 2 years
|Job Location:||Villach, Austria|