ASML - Sub Project Leader EUV Wafer Clamping Job in Veldhoven, Netherlands

ASML is one of the world’s leading manufacturers of chip-making equipment.

Our vision is to enable affordable microelectronics that improve the quality of life.

To achieve this, our mission is to invent, develop, manufacture and service advanced technology for high-tech lithography, metrology and software solutions for the semiconductor industry.

ASML's guiding principle is continuing Moore's Law towards ever smaller, cheaper, more powerful and energy-efficient semiconductors. This results in increasingly powerful and capable electronics that enable the world to progress within a multitude of fields, including healthcare, technology, communications, energy, mobility, and entertainment.

ASML - Sub Project Leader EUV Wafer Clamping Job Description

As a sub-project leader you are member of the wafer clamping project and responsible for a subset of deliverables of this project.
You will drive the development of a new electrostatic wafer clamp that will be developed for our next high end EUV platform (the NXE 3500).

You do this by managing a small multidisciplinary team (< 10 FTE) on a daily basis though several stages of the product development cycle: from the feasibility phase, to the detailed design phase, to the integration and test phase until finally a volume-ready product is realized. Clamps are manufactured at companies in Germany and USA, so you will closely interact with people from these companies. In the end you will have completed your set of deliverables at the desired quality, within the given timing and budget constraints.

Job Description
The responsibilities of a sub project leader within EUV wafer clamping group consist of;

• Plan and control: define and maintain a project plan to meet the agreed set of deliverables. Execute progress tracking and meet milestones at given timing and budget constraints. Technical alignment is done with the architects and system engineering.  You support the project lead (PL) in preparation of the RFF process.
• Organization and team structure: set up effective team organization that reflects the work content , ensuring the team is at right information level and interdependencies are identified and managed.
• Risk and escalation management: technical and non-technical risks for new designs and processes will be evaluated by means of FMEAs. You understand the proper escalation paths and act accordingly. Solve problems/escalations with the team and lead the team.
• Communication: you will clearly communicate minutes of meetings with the team and suppliers. You report progress of your project to PL and program and will assist the PL in progress reviews.
• Stakeholder management: As a clamp sub project leader you will interact with many internal and external stakeholders. With attention to cultural differences you build a good relation with the teams in Germany and USA who take care of the production of the clamp. Other sectors you will interface with are factory, customer support, research, Systems Enigineering, marketing, and procurement.

ASML - Sub Project Leader EUV Wafer Clamping Job Requirements

Master Degree or PhD in Mechanical Engineering, Mechatronics, Physics or Electronics 

Experience

• Experience in an industrial environment with high tech products and complex production processes in multi-disciplinary projects.
• Experience in leading a team of technical experts. Project management experience is a pre.

• Strong social and communication skills to build lasting relations and create an atmosphere of cooperation and trust.
• Solid technical background to understand and explain the technical challenges and solutions.
• Goal orientation: you show a high level of commitment to realize agreed objectives and take full ownership to overcome obstacles.
• Flexibility: you act with a high level of adaptation to changing circumstances and adjust your style of interaction to different (intercultural) teams and people.
• Self-reflects on own behavior and performance to identify strengths and development needs in skills or knowledge.
• Self-propelling: act pro-active, take initiative and always act to the greater good of the product such that they serve our customer needs.
• Excellent communication skills in speech and writing
• Willing to travel regularly (< 1 per month)

ASML - Sub Project Leader EUV Wafer Clamping Application Information

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ASML - Sub Project Leader EUV Wafer Clamping Summary

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